In this work we demonstrate a new selective metallization technique to perform localized plating on the screen-printed Al contact using the innovative approach based on Dynamic Liquid Drop/Meniscus that is able to touch the cell back contact in specific defined positions and show that it is possible to produce suitable electrical and mechanical contact with Al-Si and thus to replace the silver from the back contact in the cell manufacturing process reducing the solar cell cost. A fast pre-treatment process was developed to clean and prepare the surface of the aluminum on the back side of PV cells allowing direct plating with good electrical contact. Several commercial aluminum screen printable pastes have been experimented also having different distribution of sphere particles dimensions. We have used high resolution Scanning Electron Microscopy (SEM) and compositional microanalysis with Energy Dispersive X-Ray microanalysis (EDX) to evaluate the metal dispersion within aluminum-silicon inter-diffused region and Transfer Length Method and current-voltage measurements to estimate the specific contact resistivity of the metal contact and series resistance of the overall solar cell device. We have found that the interconnection ribbon soldered on tin contacts plated on screen printed aluminum back contact shows adhesion higher (> 1N/mm) than that verified on screen printed silver over silicon. The main difference between a tin pad and a nickel-tin pad will be shown. Efficiency increase and fill factor are compared respect standard Al-Ag back contact PV cell.
|Titolo:||Localized metal plating on aluminum back side PV cells|
|Data di pubblicazione:||2014|
|Appare nelle tipologie:||4.1 Contributo in Atti di convegno|